FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

The New Industry: Will the Growth Continue?

April 30, 2024 | I-Connect007 Editorial Team

How sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.





MORE ARTICLES
COLUMNS:

It’s Only Common Sense: Nice Guys Really Can Finish First

April 29, 2024 | Dan Beaulieu, It's Only Common Sense

You've heard the adage, “Nice guys finish last.” This hasn’t proven true for me. In fact, I’ve found it to be the exact opposite. On the other hand, I got stories about not-so-nice guys that have ended disastrously. There was...

The Right Approach: I Hear the Train A Comin'

April 25, 2024 | Steve Williams, The Right Approach

Training is often an afterthought in many organizations, and the longer a company has been in business, the more this seems to apply. Over the past couple of decades, it has been amazing to observe that the biggest offenders of this...

Marcy's Musings: The Growing Industry

April 16, 2024 | Marcy LaRont, Marcy's Musings

After decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating...

I Don't Want to Miss it List!

Are you missing out?
Customize your section here.

Edit List Settings



Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in